czwartek, 24 lipca 2014

Amazon's 'Fire' smartphone contains chips from Qualcomm, Samsung, NXP

An Amazon Fire smartphone is seen opened up during a teardown procedure in a handout picture provided by iFixit By Noel Randewich SAN FRANCISCO (Reuters) - Amazon.com Inc's new "Fire" smartphone contains chips from Qualcomm Inc, NXP Semiconductors NV, and Samsung Electronics Co Ltd, according to repair and teardown specialists iFixit, which pried one open on Thursday. The Fire phone also houses chips from Synaptics Inc and Skyworks Solutions Inc, said the repair outfit, which made a name for itself taking apart devices like Apple Inc's iPhone and identifying its internal components.








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